Luke England

According to our database, Luke England authored at least 5 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Compact Scalable Dynamic TSV IR Drop Compensation for Power Delivery in 3D Packages.

Arjun Chaudhuri, Sukeshwar Kannan, Luke England, Jack Golz

Proceedings of the 62nd IEEE International Midwest Symposium on Circuits and Systems, 2019

2017

Design of a digital IP for 3D-IC die-to-die clock synchronization.

Mehdi Sadi, Sukeshwar Kannan, Luke England, Mark M. Tehranipoor

Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2016

Power delivery in 3D packages: current crowding effects, dynamic IR drop and compensation network using sensors (invited paper).

Sukeshwar Kannan, Mehdi Sadi, Luke England

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Impact of TSV integration on 14nm FinFET device performance.

Luke England, Sukeshwar Kannan, Rahul Agarwal, Daniel Smith

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2011

Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes.

Luke England, Siew Tze Eng, Chris Liew, Hock Heng Lim

Microelectron. Reliab., 2011