Luhua Deng
According to our database1,
Luhua Deng
authored at least 2 papers
between 2006 and 2011.
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Bibliography
2011
Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging.
Microelectron. Reliab., 2011
2006
Proceedings of the IEEE International Conference on Robotics and Biomimetics, 2006