Lucile Arnaud

According to our database, Lucile Arnaud authored at least 12 papers between 2013 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Apocalypse Dog.

Aziliz Le Clainche, Camille Nasarre, Jing Qian, Juliette Barraux, Emma Plumey, Lucile Arnaud, Solène Cauchie, Philippe Meis

Proceedings of the SIGGRAPH Asia 2022 Computer Animation Festival, 2022

2021

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

IEEE J. Solid State Circuits, 2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.

Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2020

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2019

Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects.

Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

BISTs for post-bond test and electrical analysis of high density 3D interconnect defects.

Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné

Proceedings of the 23rd IEEE European Test Symposium, 2018

2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Towards high density 3D interconnections.

Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Interconnect design study for electromigration reliability improvement.

Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Study of EM void nucleation and mechanic relaxation effects.

Giulio Marti, Lucile Arnaud, Yves Wouters

Microelectron. Reliab., 2014

2013

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon

Microelectron. Reliab., 2013