Luca Magagni

According to our database1, Luca Magagni authored at least 8 papers between 2003 and 2008.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
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Links

On csauthors.net:

Bibliography

2008
3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities.
IEEE J. Solid State Circuits, 2008

2007
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly.
IEEE J. Solid State Circuits, 2007

3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities.
Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007

3D Capacitive Interconnections for High Speed Interchip Communication.
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007

2006
Yield prediction for 3D capacitive interconnections.
Proceedings of the 2006 International Conference on Computer-Aided Design, 2006

2005
Electrical measurement of alignment for 3D stacked chips.
Proceedings of the 31st European Solid-State Circuits Conference, 2005

A 0.14mW/Gbps high-density capacitive interface for 3D system integration.
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005

2003
A system level IP integration methodology for fast SOC design.
Proceedings of the 2003 International Symposium on System-on-Chip, 2003


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