Lokesh Siddhu

According to our database, Lokesh Siddhu authored at least 11 papers between 2014 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

ML-Based Thermal and Cache Contention Alleviation on Clustered Manycores With 3-D HBM.

Mohammed Bakr Sikal, Heba Khdr, Lokesh Siddhu, Jörg Henkel

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2024

NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching.

Shailja Pandey, Lokesh Siddhu, Preeti Ranjan Panda

ACM Trans. Design Autom. Electr. Syst., January, 2024

2023

Swift-CNN: Leveraging PCM Memory's Fast Write Mode to Accelerate CNNs.

Lokesh Siddhu, Hassan Nassar, Lars Bauer, Christian Hakert, Nils Hölscher, Jian-Jia Chen, Jörg Henkel

IEEE Embed. Syst. Lett., December, 2023

Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.

Lokesh Siddhu, Aritra Bagchi, Rajesh Kedia, Isaar Ahmad, Shailja Pandey, Preeti Ranjan Panda

ACM Trans. Embed. Comput. Syst., November, 2023

Special Session - Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications.

Jörg Henkel, Lokesh Siddhu, Lars Bauer, Jürgen Teich, Stefan Wildermann, Mehdi B. Tahoori, Mahta Mayahinia, Jerónimo Castrillón, Asif Ali Khan, Hamid Farzaneh, João Paulo C. de Lima, Jian-Jia Chen, Christian Hakert, Kuan-Hsun Chen, Chia-Lin Yang, Hsiang-Yun Cheng

Proceedings of the International Conference on Compilers, 2023

2022

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems.

Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda

ACM Trans. Archit. Code Optim., 2022

CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance.

Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda

Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021

Leakage-Aware Dynamic Thermal Management of 3D Memories.

Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda

ACM Trans. Design Autom. Electr. Syst., 2021

2019

PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor.

Lokesh Siddhu, Preeti Ranjan Panda

ACM Trans. Embed. Comput. Syst., 2019

FastCool: Leakage Aware Dynamic Thermal Management of 3D Memories.

Lokesh Siddhu, Preeti Ranjan Panda

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019

2014

Operand Isolation with Reduced Overhead for Low Power Datapath Design.

Lokesh Siddhu, Amit Mishra, Virendra Singh

Proceedings of the 2014 27th International Conference on VLSI Design, 2014