Lokesh Siddhu
Orcid: 0000-0002-5312-8679
According to our database1,
Lokesh Siddhu
authored at least 12 papers
between 2014 and 2024.
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2024
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Bibliography
2024
ML-Based Thermal and Cache Contention Alleviation on Clustered Manycores With 3-D HBM.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2024
NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching.
ACM Trans. Design Autom. Electr. Syst., January, 2024
An FPGA-Based RISC-V Instruction Set Extension and Memory Controller for Multi-Level Cell NVM.
Proceedings of the International Conference on Microelectronics, 2024
2023
IEEE Embed. Syst. Lett., December, 2023
Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.
ACM Trans. Embed. Comput. Syst., November, 2023
Special Session - Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications.
Proceedings of the International Conference on Compilers, 2023
2022
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems.
ACM Trans. Archit. Code Optim., 2022
CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022
2021
ACM Trans. Design Autom. Electr. Syst., 2021
2019
PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor.
ACM Trans. Embed. Comput. Syst., 2019
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019
2014
Proceedings of the 2014 27th International Conference on VLSI Design, 2014