Lionel Cadix

According to our database, Lionel Cadix authored at least 4 papers in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2009

Influence of 3D integration on 2D interconnections and 2D self inductors HF properties.

Julie Roullard, Stéphane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard Fléchet

Proceedings of the IEEE International Conference on 3D System Integration, 2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.

Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Françis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009