Linlin Cai
Orcid: 0000-0002-0264-3953
According to our database1,
Linlin Cai
authored at least 9 papers
between 2006 and 2024.
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Bibliography
2024
Exploring thermal effects of advanced backside power delivery network beyond 3 nm node.
Microelectron. J., 2024
2023
4DCurve: A Shape-Changing Fabrication Method Based on Curved Paths with a 3D Printing Pen.
Proceedings of the Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems, 2023
Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems, 2023
Enhancing Temperature Immunity of Digital Circuit Against Aging : The Standard Cell Subset Method.
Proceedings of the 15th IEEE International Conference on ASIC, 2023
Machine Learning-Assisted Single-Event Transient Model of 12nm FinFETs for Circuit-Level Simulation.
Proceedings of the 15th IEEE International Conference on ASIC, 2023
2021
A physics-based electromigration reliability model for interconnects lifetime prediction.
Sci. China Inf. Sci., 2021
2019
Self-heating Induced Variability and Reliability in Advanced Logic Devices and Circuits.
Proceedings of the 13th IEEE International Conference on ASIC, 2019
2014
Knowledge-based extraction of intellectual capital-related information from unstructured data.
Expert Syst. Appl., 2014
2006
Proceedings of the On the Move to Meaningful Internet Systems 2006: OTM 2006 Workshops, 2006