Linhong Lu
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Bibliography
2024
Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.
Microelectron. J., 2024
Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.
IEICE Electron. Express, 2024
Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.
IEICE Electron. Express, 2024