Linhong Lu

According to our database1, Linhong Lu authored at least 3 papers in 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2024
Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.
Microelectron. J., 2024

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.
IEICE Electron. Express, 2024

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.
IEICE Electron. Express, 2024


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