Lingyu Bi
According to our database1,
Lingyu Bi
authored at least 2 papers
between 2019 and 2022.
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Bibliography
2022
Impact of ground solder ball failure in BGA package on near electric field radiation.
IEICE Electron. Express, 2022
2019
Investigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission.
IET Circuits Devices Syst., 2019