Lingjun Zhu

According to our database, Lingjun Zhu authored at least 33 papers between 2013 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2024

A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping.

Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., March, 2024

Demystifying Datapath Accelerator Enhanced Off-path SmartNIC.

Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Yin Zhang, Ming Liu, Zeke Wang

CoRR, 2024

Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs.

Lingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim

Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design, 2024

What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store.

Weidong Zhang, Erci Xu, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dai, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu

Proceedings of the 22nd USENIX Conference on File and Storage Technologies, 2024

GNN-assisted Back-side Clock Routing Methodology for Advance Technologies.

Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

2023

On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs.

Gauthaman Murali, Aditya Iyer, Lingjun Zhu, Jianming Tong, Francisco Muñoz-Martínez, Srivatsa Rangachar Srinivasa, Tanay Karnik, Tushar Krishna, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., October, 2023

Buffer-Based High-Coverage and Low-Overhead Request Event Monitoring in the Cloud.

Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang, Xiang Deng, Cheng Zhou, Lu Lu

IEEE/ACM Trans. Netw., August, 2023

What are the actual needs of visually impaired people?

Menghan Hu, Qingyi Zhu, Lingjun Zhu

Displays, July, 2023

Deploying User-space TCP at Cloud Scale with LUNA.

Lingjun Zhu, Yifan Shen, Erci Xu, Bo Shi, Ting Fu, Shu Ma, Shuguang Chen, Zhongyu Wang, Haonan Wu, Xingyu Liao, Zhendan Yang, Zhongqing Chen, Wei Lin, Yijun Hou, Rong Liu, Chao Shi, Jiaji Zhu, Jiesheng Wu

Proceedings of the 2023 USENIX Annual Technical Conference, 2023

A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node.

Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim

Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2023

SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage.

Jie Zhang, Hongjing Huang, Lingjun Zhu, Shu Ma, Dazhong Rong, Yijun Hou, Mo Sun, Chaojie Gu, Peng Cheng, Chao Shi, Zeke Wang

Proceedings of the 50th Annual International Symposium on Computer Architecture, 2023

INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps.

Lingjun Zhu, Sung Kyu Lim

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.

Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022

A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs.

Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Design Automation and Test Solutions for Monolithic 3D ICs.

Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2022

From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud.

Rui Miao, Lingjun Zhu, Shu Ma, Kun Qian, Shujun Zhuang, Bo Li, Shuguang Cheng, Jiaqi Gao, Yan Zhuang, Pengcheng Zhang, Rong Liu, Chao Shi, Binzhang Fu, Jiaji Zhu, Jiesheng Wu, Dennis Cai, Hongqiang Harry Liu

Proceedings of the SIGCOMM '22: ACM SIGCOMM 2022 Conference, Amsterdam, The Netherlands, August 22, 2022

Buffer-based End-to-end Request Event Monitoring in the Cloud.

Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang

Proceedings of the 19th USENIX Symposium on Networked Systems Design and Implementation, 2022

3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs.

Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim

Proceedings of the ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1, 2022

2021

High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors.

Lingjun Zhu, Lennart Bamberg, Sai Surya Kiran Pentapati, Kyungwook Chang, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Brian Cline, Saurabh Sinha, Xiaoqing Xu, Alberto García-Ortiz, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2021

Identification of key genes, pathways, and associated comorbidities in chikungunya infection: insights from system biology analysis.

Lingjun Zhu, Xiaodong Wang, Tania Akter Asa, Md. Ali Hossain

Netw. Model. Anal. Health Informatics Bioinform., 2021

Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators.

Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna

Proceedings of the 22nd International Symposium on Quality Electronic Design, 2021

Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies.

Lingjun Zhu, Sung Kyu Lim

Proceedings of the ISPD '21: International Symposium on Physical Design, 2021

Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture.

Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim

Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2021

Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options.

Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim

Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021

2020

Vortex: OpenCL Compatible RISC-V GPGPU.

Fares Elsabbagh, Blaise Tine, Priyadarshini Roshan, Ethan Lyons, Euna Kim, Da Eun Shim, Lingjun Zhu, Sung Kyu Lim, Hyesoon Kim

CoRR, 2020

Heterogeneous 3D Integration for a RISC-V System With STT-MRAM.

Lingjun Zhu, Lennart Bamberg, Anthony Agnesina, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Julien Ryckaert, Alberto García-Ortiz, Sung Kyu Lim

IEEE Comput. Archit. Lett., 2020

Flow Event Telemetry on Programmable Data Plane.

Yu Zhou, Chen Sun, Hongqiang Harry Liu, Rui Miao, Shi Bai, Bo Li, Zhilong Zheng, Lingjun Zhu, Zhen Shen, Yongqing Xi, Pengcheng Zhang, Dennis Cai, Ming Zhang, Mingwei Xu

Proceedings of the SIGCOMM '20: Proceedings of the 2020 Annual conference of the ACM Special Interest Group on Data Communication on the applications, 2020

Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs.

Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim

Proceedings of the ISPD 2020: International Symposium on Physical Design, Taipei, Taiwan, March 29, 2020

Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs.

Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim

Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs.

Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim

Proceedings of the 57th ACM/IEEE Design Automation Conference, 2020

The Financial Archives Management System of University Based on Computer Network Technology.

Lingjun Zhu

Proceedings of the Cyber Security Intelligence and Analytics, 2020

2019

A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology.

Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim

IEEE Micro, 2019

2013

Study on Steering by Wire Controller Based on Improved H∞ Algorithm.

Huipeng Chen, Lingjun Zhu, Xiaofan Liu, Sunan Yu, Dingcheng Zhao

Int. J. Online Eng., 2013