Lingfeng Zhou

Orcid: 0009-0006-0301-0855

According to our database1, Lingfeng Zhou authored at least 13 papers between 2016 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
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Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Other 

Links

On csauthors.net:

Bibliography

2025
An End-to-End Bundled-Data Asynchronous Circuits Design Flow: From RTL to GDS.
IEEE Trans. Very Large Scale Integr. Syst., January, 2025

2024
Toward Efficient Asynchronous Circuits Design Flow Using Backward Delay Propagation Constraint.
IEEE Trans. Very Large Scale Integr. Syst., October, 2024

LAC: A Novel Lightweight Asynchronous Controller With Optimized Phase Shift.
IEEE Trans. Circuits Syst. II Express Briefs, August, 2024

Better-Than-Worst-Case: A Frequency Adaptation Asynchronous RISC-V Core With Vector Extension.
IEEE Trans. Very Large Scale Integr. Syst., June, 2024

Deep learning nomogram for preoperative distinction between Xanthogranulomatous cholecystitis and gallbladder carcinoma: A novel approach for surgical decision.
Comput. Biol. Medicine, January, 2024

Intelligent Computing Social Modeling and Methodological Innovations in Political Science in the Era of Large Language Models.
CoRR, 2024

Data-Centric Foundation Models in Computational Healthcare: A Survey.
CoRR, 2024

An Efficient Asynchronous Circuits Design Flow with Backward Delay Propagation Constraint.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2024

2023
Gated Recurrent Unit Embedded with Dual Spatial Convolution for Long-Term Traffic Flow Prediction.
ISPRS Int. J. Geo Inf., September, 2023

Influential Topographic Factor Identification of Soil Heavy Metals Using GeoDetector: The Effects of DEM Resolution and Pollution Sources.
Remote. Sens., August, 2023

Improvements on Recommender System based on Mathematical Principles.
CoRR, 2023

Towards Energy-Efficient Asynchronous Circuit Design with Flip-Flop-to-Latch Replacement.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023

2016
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016


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