Ling gang Liu

According to our database, Ling gang Liu authored at least 1 paper in 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging.

Junhui Li, Luhua Deng, Bangke Ma, Ling gang Liu, Fuliang Wang, Lei Han

Microelectron. Reliab., 2011