Liewei Bao

According to our database, Liewei Bao authored at least 3 papers between 2007 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

34.1 An 8960-Element Ultrasound-on-Chip for Point-of-Care Ultrasound.

Nevada Sanchez, Kailiang Chen, Chao Chen, Dan McMahill, Sewook Hwang, Joseph Lutsky, Jungwook Yang, Liewei Bao, Leung Kin Chiu, Graham Peyton, Hamid Soleimani, Bob Ryan, J. R. Petrus, Youn-Jae Kook, Tyler S. Ralston, Keith Fife, Jonathan Rothberg

Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2008

TILE64 - Processor: A 64-Core SoC with Mesh Interconnect.

Shane Bell, Bruce Edwards, John Amann, Rich Conlin, Kevin Joyce, Vince Leung, John MacKay, Mike Reif, Liewei Bao, John F. Brown III, Matthew Mattina, Chyi-Chang Miao, Carl Ramey, David Wentzlaff, Walker Anderson, Ethan Berger, Nat Fairbanks, Durlov Khan, Froilan Montenegro, Jay Stickney, John Zook

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

2007

On-Chip Interconnection Architecture of the Tile Processor.

David Wentzlaff, Patrick Griffin, Henry Hoffmann, Liewei Bao, Bruce Edwards, Carl Ramey, Matthew Mattina, Chyi-Chang Miao, John F. Brown III, Anant Agarwal

IEEE Micro, 2007