Liangliang Luo

According to our database, Liangliang Luo authored at least 1 paper in 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Thermal and mechanical effects of voids within flip chip soldering in LED packages.

Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo

Microelectron. Reliab., 2014