Liangchi Zhang
Orcid: 0000-0002-8607-0426
According to our database1,
Liangchi Zhang
authored at least 4 papers
between 2001 and 2023.
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Bibliography
2023
IEEE Trans. Instrum. Meas., 2023
2018
Growth nature of in-situ Cu<sub>6</sub>Sn<sub>5</sub>-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity.
Microelectron. Reliab., 2018
High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material.
Microelectron. Reliab., 2018
2001