Leo J. Ernst

According to our database, Leo J. Ernst authored at least 19 papers between 2003 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Characterization of the viscoelastic properties of an epoxy molding compound during cure.

M. Sadeghinia, Kaspar M. B. Jansen, Leo J. Ernst

Microelectron. Reliab., 2012

2010

Prediction of cure induced warpage of micro-electronic products.

Jan de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm

Microelectron. Reliab., 2010

A fast moisture sensitivity level qualification method.

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont

Microelectron. Reliab., 2010

2009

Modeling and characterization of molding compound properties during cure.

Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher

Microelectron. Reliab., 2009

2007

Molecular simulation on the material/interfacial strength of the low-dielectric materials.

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout

Microelectron. Reliab., 2007

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Measuring the through-plane elastic modulus of thin polymer films in situ.

M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel

Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.

Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang

Microelectron. Reliab., 2007

Novel shear tools for viscoelastic characterization of packaging polymers.

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers

Microelectron. Reliab., 2007

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.

Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang

Microelectron. Reliab., 2007

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach.

Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst

Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang

Microelectron. Reliab., 2007

2006

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.

Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang

Microelectron. Reliab., 2006

2004

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.

Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang

Microelectron. Reliab., 2004

Prediction of crack growth in IC passivation layers.

Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst

Microelectron. Reliab., 2004

Prediction of thermo-mechanical integrity of wafer backend processes.

Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst

Microelectron. Reliab., 2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.

Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst

Microelectron. Reliab., 2004

2003

Prediction and verification of process induced warpage of electronic packages.

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi

Microelectron. Reliab., 2003