Lei Wang
Orcid: 0000-0001-9876-7346Affiliations:
- NXP Semiconductors, Singapore
- National University of Singapore, Singapore (former)
According to our database1,
Lei Wang
authored at least 17 papers
between 2011 and 2018.
Collaborative distances:
Collaborative distances:
Timeline
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Online presence:
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on orcid.org
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Bibliography
2018
IEEE Trans. Very Large Scale Integr. Syst., 2018
An ADPLL-Based PSK Receiver for VHBR 13.56-MHz Contactless Smartcards and NFC Applications.
IEEE Trans. Circuits Syst. II Express Briefs, 2018
A 4×4 IR UWB Timed-Array Radar Based on 16-Channel Transmitter and Sampling Capacitor Reused Receiver.
IEEE Trans. Circuits Syst. II Express Briefs, 2018
2016
Proceedings of the 14th IEEE International New Circuits and Systems Conference, 2016
Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016
Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016
2015
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015
2014
A Sub-GHz Mostly Digital Impulse Radio UWB Transceiver for Wireless Body Sensor Networks.
IEEE J. Emerg. Sel. Topics Circuits Syst., 2014
Proceedings of the 21st IEEE International Conference on Electronics, Circuits and Systems, 2014
A 1.44mm<sup>2</sup> 4-channel UWB beamforming receiver with Q-compensation in 65nm CMOS.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2014
2012
3-5 GHz 4-Channel UWB Beamforming Transmitter With 1° Scanning Resolution Through Calibrated Vernier Delay Line in 0.13-µm CMOS.
IEEE J. Solid State Circuits, 2012
A SiGe BiCMOS Transmitter/Receiver Chipset With On-Chip SIW Antennas for Terahertz Applications.
IEEE J. Solid State Circuits, 2012
3-to-5GHz 4-channel UWB beamforming transmitter with 1° phase resolution through calibrated vernier delay line in 0.13μm CMOS.
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012
2011
IEEE Trans. Circuits Syst. II Express Briefs, 2011
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2011
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011