Lei Su

Orcid: 0000-0003-1190-5916

Affiliations:

Jiangnan University, Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology, Wuxi, China
Huazhong University of Science and Technology, Wuhan, China (Ph.D., 2015)

According to our database¹, Lei Su authored at least 20 papers between 2013 and 2024.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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In proceedings

Article

PhD thesis

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Bibliography

2024

Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Informatics, August, 2024

Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection.

[BibT_eX]

[DOI]

Expert Syst. Appl., March, 2024

Flip-chip solder bumps defect detection using a self-search lightweight framework.

[BibT_eX]

[DOI]

Adv. Eng. Informatics, 2024

2023

A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection.

[BibT_eX]

[DOI]

IEEE Trans. Instrum. Meas., 2023

2021

Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2021

2020

Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Informatics, 2020

2019

A novel fault diagnosis algorithm for rotating machinery based on a sparsity and neighborhood preserving deep extreme learning machine.

[BibT_eX]

[DOI]

Neurocomputing, 2019

The Explosive Nature of Tab Burrs in Li-Ion Batteries.

[BibT_eX]

[DOI]

IEEE Access, 2019

Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound.

[BibT_eX]

[DOI]

IEEE Access, 2019

A New Rotation Machinery Fault Diagnosis Method Based on Deep Structure and Sparse Least Squares Support Vector Machine.

[BibT_eX]

[DOI]

IEEE Access, 2019

2018

Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Informatics, 2018

Using GA-SVM for defect inspection of flip chips based on vibration signals.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018

2017

Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings.

[BibT_eX]

[DOI]

Sensors, 2017

New Particle Filter Based on GA for Equipment Remaining Useful Life Prediction.

[BibT_eX]

[DOI]

Sensors, 2017

2016

Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging.

[BibT_eX]

[DOI]

Sensors, 2016

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

2015

Genetic algorithms for defect detection of flip chips.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

Using RBF networks for detection and prediction of flip chip with missing bumps.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

2013

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.

[BibT_eX]

[DOI]

Sensors, 2013

Lei Su

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