Lei Peng
Orcid: 0000-0002-4077-4575Affiliations:
- ShanghaiTech University, School of Information Science and Technology, China
- Michigan State University, Department of Electrical and Computational Engineering, East Lansing, MI, USA
- Chinese Academy of Sciences, Shanghai Institute of Microsystem and Information Technology, China
- University of Chinese Academy of Sciences, Beijing, China
- Hefei University of Technology, Hefei, China (former)
According to our database1,
Lei Peng
authored at least 6 papers
between 2021 and 2022.
Collaborative distances:
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Bibliography
2022
Flexible Probe With Array Tunneling Magnetoresistance Sensors for Curved Structure Inspection.
IEEE Trans. Instrum. Meas., 2022
Flexible Array Probe With In-Plane Differential Multichannels for Inspection of Microdefects on Curved Surface.
IEEE Trans. Ind. Electron., 2022
2021
Inspection of Defects in Weld Using Differential Array ECT Probe and Deep Learning Algorithm.
IEEE Trans. Instrum. Meas., 2021
Fastener Tilt Assessment Based on Magnetic Field Image Obtained With Array Tunnel Magnetoresistance Sensors.
IEEE Trans. Instrum. Meas., 2021
Eddy Current Probe With Three-Phase Excitation and Integrated Array Tunnel Magnetoresistance Sensors.
IEEE Trans. Ind. Electron., 2021
Proceedings of the 30th IEEE International Symposium on Industrial Electronics, 2021