Léa Di Cioccio

According to our database, Léa Di Cioccio authored at least 14 papers between 2007 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment.

Josua Guérid, Jean-Baptiste Doré, Jacques Reverdy, Bruno Reig, Antonio Clemente, Léa Di Cioccio

Proceedings of the 2022 Joint European Conference on Networks and Communications & 6G Summit, 2022

2014

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding.

Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration.

Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio

Proceedings of 2013 International Conference on IC Design & Technology, 2013

Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.

Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Low temperature direct bonding: An attractive technique for heterostructures build-up.

H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet

Microelectron. Reliab., 2012

2011

Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.

Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

200°C direct bonding copper interconnects : Electrical results and reliability.

Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

System on Wafer: A New Silicon Concept in SiP.

Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude

Proc. IEEE, 2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly.

Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri

IEEE J. Solid State Circuits, 2007

3D Capacitive Interconnections for High Speed Interchip Communication.

Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri

Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007