Laurent Le-Pailleur

This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.

Bibliography

2016
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.
IEEE Des. Test, 2016

Low power advanced digital technologies to enable Internet of Things.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

2013
FDSOI: A differentiator for application processors in consumer and mobile markets.
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013

2003
A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing.
IEEE J. Solid State Circuits, 2003


  Loading...