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Larry Smith

Affiliations:
  • Sematech, Albany, NY, USA
  • University of Illinois, IL, USA (PhD)


According to our database1, Larry Smith authored at least 2 papers between 2009 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2012
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.
[BibTeX]
[DOI]
Benjamin Backes
,
Colin McDonough
,
Larry Smith
,
Wei Wang
,
Robert E. Geer
J. Electron. Test., 2012

2009
Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration.
[BibTeX]
[DOI]
Sherief Reda
,
Gregory Smith
,
Larry Smith
IEEE Trans. Very Large Scale Integr. Syst., 2009


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