L. Théolier

Orcid: 0000-0002-6149-1849

According to our database1, L. Théolier authored at least 9 papers between 2008 and 2018.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Bibliography

2018
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses.
Microelectron. Reliab., 2018

Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling.
Microelectron. Reliab., 2017

2016
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.
Microelectron. Reliab., 2016

2015
Identification and analysis of power substrates degradations subjected to severe aging tests.
Microelectron. Reliab., 2015

Ageing mechanisms in Deep Trench Termination (DT<sup>2</sup>) Diode.
Microelectron. Reliab., 2015

Mechanical stress investigation after technological process in Deep Trench Termination DT<sup>2</sup> using BenzoCycloButene as dielectric material.
Microelectron. Reliab., 2015

2013
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.
Microelectron. Reliab., 2013

2008
Switching performance of 65 V vertical N-channel FLYMOSFETs.
Microelectron. J., 2008


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