Kyung-Wook Paik
According to our database1,
Kyung-Wook Paik
authored at least 10 papers
between 2006 and 2022.
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Bibliography
2022
Sensors, 2022
2017
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly.
Microelectron. Reliab., 2017
2015
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection.
Microelectron. Reliab., 2015
2012
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).
Microelectron. Reliab., 2012
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs).
Microelectron. Reliab., 2012
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages.
Microelectron. Reliab., 2012
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high T<sub>g</sub> ACFs in fine-pitch chip-on-glass applications.
Microelectron. Reliab., 2012
2008
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications.
Microelectron. Reliab., 2008
2006
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.
Microelectron. Reliab., 2006
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study.
Microelectron. Reliab., 2006