Kyoung-Lim Suk

According to our database¹, Kyoung-Lim Suk authored at least 2 papers in 2012.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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2012

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).

[BibT_eX]

[DOI]

Microelectron. Reliab., 2012

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs).

[BibT_eX]

[DOI]

Microelectron. Reliab., 2012

Kyoung-Lim Suk

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