Kunihiro Fujiyoshi

According to our database1, Kunihiro Fujiyoshi authored at least 40 papers between 1994 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Node-to-Node and Node-to-Set Disjoint Paths Problems in Bicubes.
IEICE Trans. Inf. Syst., 2024

2023
A Necessary and Sufficient Condition to Generate Representative Clip for Edge-Constrained Clustering of Layout Pattern Classification Problem.
Proceedings of the 21st IEEE Interregional NEWCAS Conference, 2023

2017
Photo-Diode Array Partitioning Problem for a Rectangular Region.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2017

2016
A method for photo-diode array partitioning problem.
Proceedings of the IEEE 59th International Midwest Symposium on Circuits and Systems, 2016

2014
A Method of Analog IC Placement with Common Centroid Constraints.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2014

Average placement method with common centroid constraints for analog IC layout design.
Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014

Adjacent common centroid placement for analog IC layout design.
Proceedings of the 2014 IEEE Asia Pacific Conference on Circuits and Systems, 2014

2012
An efficient solution space for floorplan of 3D-LSI.
Proceedings of the 19th IEEE International Conference on Electronics, Circuits and Systems, 2012

2011
A novel representation for repeated placement.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011

2010
On the Number of Rooms in a Rectangular Solid Dissection.
J. Inf. Process., 2010

2009
A Tree Based Novel Representation for 3D-Block Packing.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009

Placement with Symmetry Constraints for Analog IC Layout Design Based on Tree Representation.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009

Representation of 3D-LSI Floorplan based on Stacked-rectangular-dissection.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2009), 2009

2008
The O-Sequence: Representation of 3D-Dissection.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2008

2007
Linear Programming-Based Cell Placement With Symmetry Constraints for Analog IC Layout.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2007

A fast algorithm for rectilinear block packing based on selected sequence-pair.
Integr., 2007

DTS: A Tree Based Representation for 3D-Block Packing.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2007), 2007

2006
Improved method of cell placement with symmetry constraints for analog IC layout design.
Proceedings of the 2006 International Symposium on Physical Design, 2006

Evaluation of 3D-packing representations for scheduling of dynamically reconfigurable systems.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2006), 2006

Thermal Driven Module Placement Using Sequence-pair.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems 2006, 2006

2005
Minimizing the Number of Empty Rooms on Floorplan by Dissection Line Merge.
IEICE Trans. Inf. Syst., 2005

A Graph Based Soft Module Handling in Floorplan.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005

2004
A novel encoding method into sequence-pair.
Proceedings of the 2004 International Symposium on Circuits and Systems, 2004

2003
An Improved Method of Convex Rectilinear Block Packing Based on Sequence-Pair.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2003

Selected sequence-pair: an efficient decodable packing representation in linear time using sequence-pair.
Proceedings of the 2003 Asia and South Pacific Design Automation Conference, 2003

2002
An Efficient Decoding Method of Sequence-Pair with Reduced Redundancy.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2002

An improved method of convex-shaped block packing based on sequence-pair [VLSI layout].
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems 2002, 2002

An efficient decoding method of sequence-pair.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems 2002, 2002

2000
Arbitrary convex and concave rectilinear block packing usingsequence-pair.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2000

Simulated annealing search through general structure floorplans using sequence-pair.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2000

1999
Arbitrary convex and concave rectilinear block packing using sequence-pair.
Proceedings of the 1999 International Symposium on Physical Design, 1999

1998
Module packing based on the BSG-structure and IC layout applications.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1998

VLSI/PCB placement with obstacles based on sequence pair.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1998

1997
Design of minimum and uniform bipartites for optimum connection blocks of FPGA.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1997

A mapping from sequence-pair to rectangular dissection.
Proceedings of the ASP-DAC '97 Asia and South Pacific Design Automation Conference, 1997

1996
VLSI module placement based on rectangle-packing by the sequence-pair.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1996

Module placement on BSG-structure and IC layout applications.
Proceedings of the 1996 IEEE/ACM International Conference on Computer-Aided Design, 1996

1995
Rectangle-packing-based module placement.
Proceedings of the 1995 IEEE/ACM International Conference on Computer-Aided Design, 1995

1994
Design of Optimum Totally Perfect Connection-Blocks of FPGA.
Proceedings of the 1994 IEEE International Symposium on Circuits and Systems, ISCAS 1994, London, England, UK, May 30, 1994

The Totally-Perfect Bipartite Graph and Its Construction.
Proceedings of the Algorithms and Computation, 5th International Symposium, 1994


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