Kuniaki Sueoka

According to our database, Kuniaki Sueoka authored at least 5 papers between 2010 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration.

Kuniaki Sueoka, Akihiro Horibe, T. Aoki, Sayuri Kohara, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Thermo-mechanical evaluation of 3D packages.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

High density 3D integration by pre-applied Inter Chip Fill.

Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2010