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Kun Wang

Orcid: 0000-0003-0033-6922

Affiliations:
  • Donghua University, Shanghai, China
  • Hunan Institute of Engineering, College of Textile & Fashion, Xiangtan, China


According to our database1, Kun Wang authored at least 1 paper in 2019.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

Legend:

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Links

Online presence:

On csauthors.net:

Bibliography

2019
Effect of hole on sound absorption coefficient of micro-perforated panels investigated by Melling computing.
[BibTeX]
[DOI]
Kun Wang
,
Wei Wang
,
Xiong Yan
Concurr. Comput. Pract. Exp., 2019


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