Kumar Sai Bondada

According to our database, Kumar Sai Bondada authored at least 5 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Wireless Mobile Distributed-MIMO for 6G.

Kumar Sai Bondada, Daniel J. Jakubisin, Karim Said, R. Michael Buehrer, Lingjia Liu

Proceedings of the 100th IEEE Vehicular Technology Conference, 2024

Bit Error Rate Analysis for 5G New Radio Interface Augmented by a Spread Spectrum Underlay.

Kumar Sai Bondada, Daniel J. Jakubisin, Nishith D. Tripathi, Jeffrey H. Reed

Proceedings of the IEEE International Conference on Communications, 2024

2023

Underlay-based 5G Sidelink with Co-channel Interference Cancellation.

Hanchao Yang, Kumar Sai Bondada, Xiang Cheng, Daniel J. Jakubisin, Nishith D. Tripathi, Yaling Yang, Gustave Anderson, Jeffrey H. Reed

Proceedings of the IEEE Military Communications Conference, 2023

Enhanced Non-preemptive Support of URLLC using Spread Spectrum Underlay Signalling.

Kumar Sai Bondada, Hanchao Yang, Xiang Cheng, Daniel J. Jakubisin, Nishith D. Tripathi, Gus Anderson, Yaling Yang, Jeffrey H. Reed

Proceedings of the IEEE Military Communications Conference, 2023

Demonstration of 5G-Underlay Signal Co-existence.

Kumar Sai Bondada, Xiang Cheng, Hanchao Yang, Daniel J. Jakubisin, Nishith D. Tripathi, G. Anderson, Yaling Yang, Jeffrey H. Reed

Proceedings of the IEEE Military Communications Conference, 2023