Kuan Yew Cheong
Orcid: 0000-0001-8049-0297
According to our database1,
Kuan Yew Cheong
authored at least 3 papers
between 2003 and 2013.
Collaborative distances:
Collaborative distances:
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Bibliography
2013
Reliability of sintered Ag<sub>80</sub>-Al<sub>20</sub> die attach nanopaste for high temperature applications on SiC power devices.
Microelectron. Reliab., 2013
2007
Effects of precursor aging and post-deposition treatment time on photo-assisted sol-gel derived low-dielectric constant SiO<sub>2</sub> thin film on Si.
Microelectron. J., 2007
2003