Krzysztof Górecki

Orcid: 0000-0002-9857-8235

According to our database1, Krzysztof Górecki authored at least 62 papers between 2002 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2024
Predicting the Workload of the Repair Department in a Company Producing Electronic Modules.
Proceedings of the 31st International Conference on Mixed Design of Integrated Circuits and System , 2024

Analysis of an Influence of the Colour of the Emitted Light on Dynamic Properties of Power LEDs.
Proceedings of the 31st International Conference on Mixed Design of Integrated Circuits and System , 2024

Modeling Dynamic Properties of an Alkaline Electrolyzer.
Proceedings of the 14th International Conference on Advanced Computer Information Technologies, 2024

2023
Investigations on Properties of a Laboratory System for Wireless Power Transfer.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

Investigations on an Influence of Selected Factors on Thermal Phenomena in Planar Transformers.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

Comparison of Methods for Thermal Parameters Measurements of an Air Transformer.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

Modelling Properties of Batteries using the SPICE Software.
Proceedings of the 13th International Conference on Advanced Computer Information Technologies, 2023

2022
Influence of the Measurement Method and the Cooling System on the Obtained Values of the Junction Temperature of Power MOSFETs.
Proceedings of the 29th International Conference on Mixed Design of Integrated Circuits and System, 2022

Influence of the IGBT Module Thermal Model Form on the Accuracy of Electrothermal Computations.
Proceedings of the 29th International Conference on Mixed Design of Integrated Circuits and System, 2022

2021
Improved Method for Measuring Power Losses in the Inductor Core.
IEEE Trans. Instrum. Meas., 2021

Spatial Radiation Patterns of Selected Solid State Light Sources.
Proceedings of the 2021 28th International Conference on Mixed Design of Integrated Circuits and System, 2021

Comparison of the Usefulness of Selected Thermo-sensitive Parameters of Power MOSFETs.
Proceedings of the 2021 28th International Conference on Mixed Design of Integrated Circuits and System, 2021

2020
New Method of Measurements Transient Thermal Impedance and Radial Power of Power LEDs.
IEEE Trans. Instrum. Meas., 2020

Modelling characteristics of the impulse transformer in a wide frequency range.
Int. J. Circuit Theory Appl., 2020

An Influence of the Operation Mode of a LED Lamp of the HUE Type on Its Electrical and Optical Parameters.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

Comparison of Set-ups Dedicated to Measure Thermal Parameters of Power LEDs.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

Investigations Properties of Selected Methods of Measurements of Thermal Parameters of the IGBT.
Proceedings of the 27th International Conference on Mixed Design of Integrated Circuits and System, 2020

Modeling of Photovoltaic Installation Performance Taking into Account Seasonal Phenomena of Different Climate Zones.
Proceedings of the Advances in Intelligent Systems and Computing V, 2020

Mathematical Model of Dynamics of Generated Electric Power by Photovoltaic Installation Taking into Account a Seasonality Factor.
Proceedings of the 10th International Conference on Advanced Computer Information Technologies, 2020

2019
Measurements of Parameters of the Thermal Model of the IGBT Module.
IEEE Trans. Instrum. Meas., 2019

Application of Average Electrothermal Models in the SPICE-Aided Analysis of Boost Converters.
IEEE Trans. Ind. Electron., 2019

Thermal Characterisation of Colour Power LEDs.
Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

Investigations of lnfluence of Properties of PCB on Thermal and Optical Parameters of the LED Module.
Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

Modelling a Half-bridge de-de Converter Including the IGBT Module with Thermal Phenomena Taken into Account.
Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

Mathematical Model of Weather Conditions Influence on Properties of Photovoltaic Installation and Method of its Identification.
Proceedings of the 9th International Conference on Advanced Computer Information Technologies, 2019

2018
New dynamic electro-thermo-optical model of power LEDs.
Microelectron. Reliab., 2018

Modeling power supplies of LED lamps.
Int. J. Circuit Theory Appl., 2018

Electrical model of the alkaline electrolyser dedicated for SPICE.
Int. J. Circuit Theory Appl., 2018

Influence of Cooling Conditions of Power LEDs on Their Electrical, Thermal and Optical Parameters.
Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018

New Model of Solar Cells for SPICE.
Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018

2017
Modelling LED lamps in SPICE with thermal phenomena taken into account.
Microelectron. Reliab., 2017

Modelling the temperature influence on dc characteristics of the IGBT.
Microelectron. Reliab., 2017

Compact thermal model of planar transformers.
Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems, 2017

Modelling the influence of weather conditions on properties of the photovoltaic installation.
Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems, 2017

2016
Modelling simple photovoltaic systems with thermal phenomena taken into account.
Proceedings of the 2016 MIXDES, 2016

High-temperature properties of Schottky diodes made of silicon carbide.
Proceedings of the 2016 MIXDES, 2016

Modelling the half-bridge dc-dc converter with selfheating taken into account.
Proceedings of the 2016 MIXDES, 2016

2015
Modelling mutual thermal interactions between power LEDs in SPICE.
Microelectron. Reliab., 2015

Application of the electrothermal average inductor model for analyses of boost converters.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

Modelling power LEDs with thermal phenomena taken into account.
Proceedings of the 22nd International Conference Mixed Design of Integrated Circuits & Systems, 2015

2014
Parameter estimation of the electrothermal model of the ferromagnetic core.
Microelectron. Reliab., 2014

The compact thermal model of the pulse transformer.
Microelectron. J., 2014

The influence of the selected factors on transient thermal impedance of semiconductor devices.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

The influence of the mounting manner of the power LEDs on its thermal and optical parameters.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

Modelling the influence of self-heating on characteristics of IGBTs.
Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

2013
Measuring system for determining thermal parameters of semiconductor devices.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013

The dc measurement method of thermal resistance of IGBTs.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013

2009
Electrothermal analysis of the self-excited push-pull DC-DC converter.
Microelectron. Reliab., 2009

Non-linear average electrothermal models of buck and boost converters for SPICE.
Microelectron. Reliab., 2009

2008
Electrothermal compact macromodel of monolithic switching voltage regulator MC34063A.
Microelectron. Reliab., 2008

A new electrothermal average model of the diode-transistor switch.
Microelectron. Reliab., 2008

Modelling TrenchMOSFETs in SPICE.
Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, 2008

The method of a fast electrothermal transient analysis of a buck converter.
Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, 2008

2007
A New Measuring Method of the Thermal Resistance of Silicon p-n Diodes.
IEEE Trans. Instrum. Meas., 2007

A New Method for the Measurement of the Thermal Resistance of the Monolithic Switched Regulator LT1073.
IEEE Trans. Instrum. Meas., 2007

Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account.
Microelectron. Reliab., 2007

2006
The electrothermal macromodel of voltage mode PWM controllers for SPICE.
Microelectron. J., 2006

2005
Functional and catastrophic thermal failures in bipolar electronic circuits.
Proceedings of the 12th IEEE International Conference on Electronics, 2005

2003
The electrothermal model of the linear power supplies.
Proceedings of the 2003 International Symposium on Circuits and Systems, 2003

The new form of electrothermal model of MA7805 positive voltage regulator.
Proceedings of the 2003 10th IEEE International Conference on Electronics, 2003

The electrothermal macromodel of the monolithic voltage regulator LT1073 for SPICE.
Proceedings of the 2003 10th IEEE International Conference on Electronics, 2003

2002
On some properties of the convolution algorithms for the thermal analysis of semiconductor devices.
Proceedings of the 2002 9th IEEE International Conference on Electronics, 2002


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