Kristian Bonderup Pedersen

According to our database, Kristian Bonderup Pedersen authored at least 7 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2017

Wire bond degradation under thermo- and pure mechanical loading.

Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2017

2016

Comprehensive physical analysis of bond wire interfaces in power modules.

Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen

Microelectron. Reliab., 2016

Mechanisms of metallization degradation in high power diodes.

Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok

Microelectron. Reliab., 2016

2015

Degradation mapping in high power IGBT modules using four-point probing.

Kristian Bonderup Pedersen, Lotte Haxen Østergaard, Pramod Ghimire, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2015

Ageing monitoring in IGBT module under sinusoidal loading.

Pramod Ghimire, Kristian Bonderup Pedersen, Bjørn Rannestad, Stig Munk-Nielsen

Microelectron. Reliab., 2015

Effects of thermal cycling on aluminum metallization of power diodes.

Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok

Microelectron. Reliab., 2015

2013

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules.

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2013