Kok Tong Tan
According to our database1,
Kok Tong Tan
authored at least 3 papers
between 2004 and 2006.
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Bibliography
2006
Microelectron. Reliab., 2006
2005
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
Microelectron. Reliab., 2005
2004
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.
Microelectron. Reliab., 2004