Koji Shirakawa

According to our database, Koji Shirakawa authored at least 1 paper in 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.

Kosuke Yamashita, Shunji Kurooka, Koji Shirakawa, Yoshinori Hotta, Hirofumi Abe

Proceedings of the 2015 International 3D Systems Integration Conference, 2015