Koen Kennes
According to our database1,
Koen Kennes
authored at least 3 papers
between 2023 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
2023
2024
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1
2
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2
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024
Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration.
Proceedings of the International 3D Systems Integration Conference, 2024
2023
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023