Koen Kennes

According to our database1, Koen Kennes authored at least 3 papers between 2023 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2023
2024
0
1
2
3
2
1

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration.
Proceedings of the International 3D Systems Integration Conference, 2024

2023
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023


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