Klaus Pressel

According to our database, Klaus Pressel authored at least 6 papers between 1999 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0).

Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Müjdat Soytürk, Luigi Pomante

Proceedings of the 24th Euromicro Conference on Digital System Design, 2021

2019

I. Double-Sided Cooling Technology for Emobility.

Klaus Pressel, Andreas Grassmann, Markus Fink, Guenter Tutsch

Proceedings of the 49th European Solid-State Device Research Conference, 2019

2017

Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests.

Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle

Microelectron. Reliab., 2017

2006

Modern IC packaging trends and their reliability implications.

R. Plieninger, M. Dittes, Klaus Pressel

Microelectron. Reliab., 2006

2000

A current-folded up-conversion mixer and VCO with center-tapped inductor in a SiGe-HBT technology for 5-GHz wireless LAN applications.

Günter Grau, Ulrich Langmann, Wolfgang Winkler, Dieter Knoll, Jörg Osten, Klaus Pressel

IEEE J. Solid State Circuits, 2000

1999

Wireless communication integrated circuits with CMOS-compatible SiGe HBT technology modules.

Wolfgang Winkler, Johannes Borngräber, Heide Erzgraeber, Ha. Erzgraber, Bernd Heinemann, Dieter Knoll, H. Jörg Osten, Michael Pierschel, Klaus Pressel, Peter Schley

Proceedings of the IEEE 1999 Custom Integrated Circuits Conference, 1999