Klaus-Dieter Lang

According to our database1, Klaus-Dieter Lang authored at least 19 papers between 2012 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

On csauthors.net:

Bibliography

2021
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2019
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.
Proceedings of the 12th International Conference on Developments in eSystems Engineering, 2019

Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method.
Proceedings of the 12th International Conference on Developments in eSystems Engineering, 2019

2018
Corrosion behaviour of sintered silver under maritime environmental conditions.
Microelectron. Reliab., 2018

Optimization Parameters for Laser-induced Forward Transfer of Al and Cu on Si-wafer Substrate.
Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology, 2018

2017
Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography.
Microelectron. Reliab., 2017

The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.
Proceedings of the Eleventh International Conference on Sensing Technology, 2017

2016
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach.
Microelectron. Reliab., 2016

Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars.
Microelectron. Reliab., 2016

A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems.
Micromachines, 2016

2015
Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments.
Sensors, 2015

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding.
Microelectron. Reliab., 2015

Microstructural evolution of ultrasonic-bonded aluminum wires.
Microelectron. Reliab., 2015

From fan-out wafer to fan-out panel level packaging.
Proceedings of the European Conference on Circuit Theory and Design, 2015

2014
Improving the FE simulation of molded packages using warpage measurements.
Microelectron. Reliab., 2014

The influence of liners with Ti, Ta or Ru finish on thin Cu films.
Microelectron. Reliab., 2014

Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology.
Proceedings of the European Conference on Optical Communication, 2014

2013
Transport of moisture at epoxy-SiO<sub>2</sub> interfaces investigated by molecular modeling.
Microelectron. Reliab., 2013

2012
Development of Rechargeable Micro Batteries Based on Micro Channel Structures.
Proceedings of the 2012 IEEE International Conference on Green Computing and Communications, 2012


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