Kjeld Pedersen

According to our database, Kjeld Pedersen authored at least 4 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2017

Wire bond degradation under thermo- and pure mechanical loading.

Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2017

2016

Comprehensive physical analysis of bond wire interfaces in power modules.

Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen

Microelectron. Reliab., 2016

2015

Degradation mapping in high power IGBT modules using four-point probing.

Kristian Bonderup Pedersen, Lotte Haxen Østergaard, Pramod Ghimire, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2015

2013

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules.

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2013