King L. Tai

According to our database, King L. Tai authored at least 6 papers between 1989 and 2000.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2000

Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology.

Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai, Yee L. Low, Kevin J. O'Conner, King L. Tai

Proceedings of ASP-DAC 2000, 2000

System-in-package (SIP): challenges and opportunities.

King L. Tai

Proceedings of ASP-DAC 2000, 2000

1999

A New Bare Die Test Methodology.

Zao Yang, Kwang-Ting Cheng, King L. Tai

Proceedings of the 17th IEEE VLSI Test Symposium (VTS '99), 1999

1998

Chip-scale modules for high-level integration in the 21st century.

Jeffrey A. Gregus, Maureen Y. Lau, Yinon Degani, King L. Tai

Bell Labs Tech. J., 1998

1993

Trends in Silicon-On-Silicon Multichip Modules.

Robert C. Frye, King L. Tai, Maureen Y. Lau, Thaddeus J. Gabara

IEEE Des. Test Comput., 1993

1989

Integrated optoelectronics-to-VLSI packaging technology.

C. G. Lin-Hendel, W. J. Bertram, M. S. Dhanaliwala, R. J. Pimpinella, J. M. Segelken, King L. Tai

Proceedings of the Computer Design: VLSI in Computers and Processors, 1989