Kin Hooi Dia

According to our database, Kin Hooi Dia authored at least 2 papers between 2006 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor.

Alice Wang, Tsung-Yao Lin, Shichin Ouyang, Wei-Hung Huang, Jidong Wang, Shu-Hsin Chang, Sheng-Ping Chen, Chun-Hsiung Hu, J. C. Tai, Koan-Sin Tan, Meng-Nan Tsou, Ming-Hsien Lee, Gordon Gammie, Chi-Wei Yang, Chih-Chieh Yang, Yeh-Chi Chou, Shih-Hung Lin, Wuan Kuo, Chi-Jui Chung, Lee-Kee Yong, Chia-Wei Wang, Kin Hooi Dia, Cheng-Hsing Chien, You-Ming Tsao, N. K. Singh, Rolf Lagerquist, Chih-Cheng Chen, Uming Ko

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2006

Pre-conditioning Free Footless DCVSL for High-performance Datapaths.

Makoto Ikeda, Kin Hooi Dia, Kunihiro Asada

Proceedings of the 13th IEEE International Conference on Electronics, 2006