Khai D. T. Ngo
Orcid: 0000-0002-0326-3055
According to our database1,
Khai D. T. Ngo
authored at least 23 papers
between 2000 and 2024.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2015, "For contributions to unified synthesis and modeling of switched-mode converters".
Timeline
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Bibliography
2024
An Improved Class-E Current Inverter With Two Coupled Inductors for Isolation and Power Scaling Without Affecting Switch Voltage Stress.
IEEE Trans. Ind. Electron., August, 2024
2023
Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors.
IEEE Trans. Ind. Electron., 2023
2021
IEEE Trans. Ind. Electron., 2021
IEEE Trans. Ind. Electron., 2021
IEEE Trans. Ind. Electron., 2021
Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement.
IEEE Trans. Ind. Electron., 2021
Circuit Modeling of the Mechanical-Motion Rectifier for Electrical Simulation of Ocean Wave Power Takeoff.
IEEE Trans. Ind. Electron., 2021
2020
Physics of Degradation in SiC MOSFETs Stressed by Overvoltage and Overcurrent Switching.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
2019
Design Methodology of a One-Turn Inductor With Significant DC and AC Fluxes - Demonstration in a Resonant Cross-Commutated Buck Converter.
IEEE Trans. Ind. Electron., 2019
2018
Steady-State Analysis of Resonant Cross-Commutated Buck Converter Under Continuous Voltage Mode.
IEEE Trans. Ind. Electron., 2018
2017
Detection of Cross-Turn-On and Selection of Off Drive Voltage for an SiC Power Module.
IEEE Trans. Ind. Electron., 2017
Balancing of Peak Currents Between Paralleled SiC MOSFETs by Drive-Source Resistors and Coupled Power-Source Inductors.
IEEE Trans. Ind. Electron., 2017
IEEE Trans. Ind. Electron., 2017
2016
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection.
Microelectron. Reliab., 2016
2015
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules.
Microelectron. Reliab., 2015
2009
Dynamic Characterization of the Synthetic Ripple Modulator in a Tightly Regulated Distributed Power Application.
IEEE Trans. Ind. Electron., 2009
2007
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2007), 2007
2004
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004
2003
IEEE Trans. Instrum. Meas., 2003
2000
Parameter extraction for the extended cantilever model of magnetic component windings.
IEEE Trans. Aerosp. Electron. Syst., 2000
Proceedings of the IEEE International Symposium on Circuits and Systems, 2000