Kevin Winstel
According to our database1,
Kevin Winstel
authored at least 2 papers
in 2010.
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2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.
Proceedings of the IEEE International Conference on 3D System Integration, 2010