Keun Woo Park

According to our database, Keun Woo Park authored at least 1 paper in 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2020

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.

Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020