Kenichi Takeda

According to our database, Kenichi Takeda authored at least 8 papers between 2010 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

A Data Augmentation Method for Cow Behavior Estimation Systems Using 3-Axis Acceleration Data and Neural Network Technology.

Chao Li, Korkut Kaan Tokgoz, Ayuka Okumura, Jim Bartels, Kazuhiro Toda, Hiroaki Matsushima, Takumi Ohashi, Kenichi Takeda, Hiroyuki Ito

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2022

TinyCowNet: Memory- and Power-Minimized RNNs Implementable on Tiny Edge Devices for Lifelong Cow Behavior Distribution Estimation.

Jim Bartels, Korkut Kaan Tokgoz, Sihan A, Masamoto Fukawa, Shohei Otsubo, Chao Li, Ikumi Rachi, Kenichi Takeda, Ludovico Minati, Hiroyuki Ito

IEEE Access, 2022

2021

A 216 μW, 87% Accurate Cow Behavior Classifying Decision Tree on FPGA with Interpolated Arctan2.

Jim Bartels, Korkut Kaan Tokgoz, Masamoto Fukawa, Shohei Otsubo, Chao Li, Ikumi Rachi, Kenichi Takeda, Hiroyuki Ito

Proceedings of the IEEE International Symposium on Circuits and Systems, 2021

2017

Accuracy of computer-aided diagnosis based on narrow-band imaging endocytoscopy for diagnosing colorectal lesions: comparison with experts.

Masashi Misawa, Shin-ei Kudo, Yuichi Mori, Kenichi Takeda, Yasuharu Maeda, Shinichi Kataoka, Hiroki Nakamura, Toyoki Kudo, Kunihiko Wakamura, Takemasa Hayashi, Atsushi Katagiri, Toshiyuki Baba, Fumio Ishida, Haruhiro Inoue, Yukitaka Nimura, Masahiro Oda, Kensaku Mori

Int. J. Comput. Assist. Radiol. Surg., 2017

2013

Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme.

Yasuhiro Shinozuka, Hiroshi Fuketa, Koichi Ishida, Futoshi Furuta, Kenichi Osada, Kenichi Takeda, Makoto Takamiya, Takayasu Sakurai

Proceedings of the International Symposium on Quality Electronic Design, 2013

2011

Chip-level TSV integration for rapid prototyping of 3D system LSIs.

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Void reduction in wafer bonding by simultaneously formed ventilation channels.

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Wafer-level hybrid bonding technology with copper/polymer co-planarization.

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda

Proceedings of the IEEE International Conference on 3D System Integration, 2010