Kazuo Kondo

According to our database, Kazuo Kondo authored at least 3 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Reduction of TSV Pumping.

Quy Dinh, Kazuo Kondo, Tetsuji Hirato

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

No pumping at 450°C with electrodeposited copper TSV.

Kazuo Kondo, Shingo Mukahara, Masayuki Yokoi, Jin Onuki

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2011

3D interconnected technology by high speed copper electrodeposition using diallylamine levelers.

Taro Hayashi, Kazuo Kondo, Minoru Takeuchi, Yushi Suzuki, Takeyasu Saito, Naoki Okamoto, Masao Marunaka, Takayuki Tsuchiya, Masaru Bunya

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011