Katsuyuki Sakuma
Orcid: 0000-0001-8162-7064
According to our database1,
Katsuyuki Sakuma
authored at least 13 papers
between 1998 and 2020.
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Bibliography
2020
IEEE Access, 2020
2019
Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2019
2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.
IBM J. Res. Dev., 2008
1998