Kalya Shubhakar

According to our database1, Kalya Shubhakar authored at least 10 papers between 2014 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2022
Enhanced Learning Experience for Remote Students in Hybrid Class Model using 360° View Camera and Telepresence Robot.
Proceedings of the IEEE International Conference on Teaching, 2022

2020
Reliability and Breakdown Study of Erase Gate Oxide in Split-Gate Non-Volatile Memory Device.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Dielectric Breakdown in 2D Layered Hexagonal Boron Nitride - The Knowns and the Unknowns.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Mechanism of soft and hard breakdown in hexagonal boron nitride 2D dielectrics.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016
Conductive filament formation at grain boundary locations in polycrystalline HfO<sub>2</sub> -based MIM stacks: Computational and physical insight.
Microelectron. Reliab., 2016

Analysis of quantum conductance, read disturb and switching statistics in HfO<sub>2</sub> RRAM using conductive AFM.
Microelectron. Reliab., 2016

Effects of thermal annealing on the charge localization characteristics of HfO<sub>2</sub>/Au/HfO<sub>2</sub> stack.
Microelectron. Reliab., 2016

2015
An SEM/STM based nanoprobing and TEM study of breakdown locations in HfO<sub>2</sub>/SiO<sub>x</sub> dielectric stacks for failure analysis.
Microelectron. Reliab., 2015

2014
Impact of local structural and electrical properties of grain boundaries in polycrystalline HfO<sub>2</sub> on reliability of SiO<sub>x</sub> interfacial layer.
Microelectron. Reliab., 2014

High-κ dielectric breakdown in nanoscale logic devices - Scientific insight and technology impact.
Microelectron. Reliab., 2014


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