Kai Zoschke

According to our database, Kai Zoschke authored at least 5 papers between 2010 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.

Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Bäuscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer

Proceedings of the 12th International Conference on Developments in eSystems Engineering, 2019

2018

Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster.

Kai Zoschke, Maurice Güttler, Lars Böttcher, Andreas Grübl, Dan Husmann de Oliveira, Johannes Schemmel, Karlheinz Meier, Oswin Ehrmann

CoRR, 2018

2014

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-µW RTC Mode and Programmable HF Clocks.

David Ruffieux, Nicola Scolari, Frédéric Giroud, Thanh-Chau Le, Silvio Dalla Piazza, Felix Staub, Kai Zoschke, Charles Alix Manier, Hermann Oppermann, Tommi Suni, James Dekker, Giorgio Allegato

IEEE J. Solid State Circuits, 2014

2013

3D integration of standard integrated circuits.

Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2010

Silicon-interposer with high density Cu-filled TSVs.

Robert Wieland, Kai Zoschke, Nils Jurgensen, Karl-Reinhard Merkel, Lars Nebrich, Jürgen Wolf

Proceedings of the IEEE International Conference on 3D System Integration, 2010