K. N. Subramanian

According to our database, K. N. Subramanian authored at least 2 papers between 2007 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2017

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages.

Yuelin Wu, K. N. Subramanian, Scott Calabrese Barton, Andre Lee

Microelectron. Reliab., 2017

2007

Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints.

J. G. Lee, K. N. Subramanian

Microelectron. Reliab., 2007