K. C. Leong

According to our database, K. C. Leong authored at least 2 papers between 2011 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.

Chuan Seng Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong

Microelectron. Reliab., 2012

2011

Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone.

Dau Fatt Lim, K. C. Leong, Chuan Seng Tan

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011